Title 40

PART 98 SUBPART I

Subpart I - Electronics Manufacturing Source:75 FR 74818, Dec. 1, 2010, unless otherwise noted.

• 42 U.S.C. 7401-7671q.
• Source: 74 FR 56374, Oct. 30, 2009, unless otherwise noted.

40:23.0.1.1.3.9.1.1	SECTION 98.90	98.90 Definition of the source category.
40:23.0.1.1.3.9.1.2	SECTION 98.91	98.91 Reporting threshold.
40:23.0.1.1.3.9.1.3	SECTION 98.92	98.92 GHGs to report.
40:23.0.1.1.3.9.1.4	SECTION 98.93	98.93 Calculating GHG emissions.
40:23.0.1.1.3.9.1.5	SECTION 98.94	98.94 Monitoring and QA/QC requirements.
40:23.0.1.1.3.9.1.6	SECTION 98.95	98.95 Procedures for estimating missing data.
40:23.0.1.1.3.9.1.7	SECTION 98.96	98.96 Data reporting requirements.
40:23.0.1.1.3.9.1.8	SECTION 98.97	98.97 Records that must be retained.
40:23.0.1.1.3.9.1.9	SECTION 98.98	98.98 Definitions.
40:23.0.1.1.3.9.1.10.22	APPENDIX	Table I-1 to Subpart I of Part 98 - Default Emission Factors for Threshold Applicability Determination
40:23.0.1.1.3.9.1.10.23	APPENDIX	Table I-2 to Subpart I of Part 98 - Examples of Fluorinated GHGs Used by the Electronics Industry
40:23.0.1.1.3.9.1.10.24	APPENDIX	Table I-3 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes
40:23.0.1.1.3.9.1.10.25	APPENDIX	Table I-4 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size
40:23.0.1.1.3.9.1.10.26	APPENDIX	Table I-5 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing
40:23.0.1.1.3.9.1.10.27	APPENDIX	Table I-6 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for LCD Manufacturing
40:23.0.1.1.3.9.1.10.28	APPENDIX	Table I-7 To Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for PV Manufacturing
40:23.0.1.1.3.9.1.10.29	APPENDIX	Table I-8 to Subpart I of Part 98 - Default Emission Factors (1-UN2O,j) for N2O Utilization (UN2O,j)
40:23.0.1.1.3.9.1.10.30	APPENDIX	Table I-9 to Subpart I of Part 98 - Methods and Procedures for Conducting Emissions Test for Stack Systems
40:23.0.1.1.3.9.1.10.31	APPENDIX	Table I-10 to Subpart I of Part 98 - Maximum Field Detection Limits Applicable to Fluorinated GHG Concentration Measurements for Stack Systems
40:23.0.1.1.3.9.1.10.32	APPENDIX	Table I-11 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for Use With the Stack Test Method (150 mm and 200 mm Wafers)
40:23.0.1.1.3.9.1.10.33	APPENDIX	Table I-12 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for Use With the Stack Test Method (300 mm and 450 mm Wafers)
40:23.0.1.1.3.9.1.10.34	APPENDIX	Table I-13 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for LCD Manufacturing for Use With the Stack Test Method
40:23.0.1.1.3.9.1.10.35	APPENDIX	Table I-14 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for PV Manufacturing for Use With the Stack Test Method
40:23.0.1.1.3.9.1.10.36	APPENDIX	Table I-15 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing for Use With the Stack Test Method
40:23.0.1.1.3.9.1.10.37	APPENDIX	Table I-16 to Subpart I of Part 98 - Default Emission Destruction or Removal Efficiency (DRE) Factors for Electronics Manufacturing
40:23.0.1.1.3.9.1.10.38	APPENDIX	Table I-17 to Subpart I of Part 98 - Expected and Possible By-Products for Electronics Manufacturinglg
40:23.0.1.1.3.9.1.10.39	APPENDIX Appendix A	Appendix A to Subpart I of Part 98 - Alternative Procedures for Measuring Point-of-Use Abatement Device Destruction or Removal Efficiency

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