Subpart I—Electronics Manufacturing
Contents
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98.90
§ 98.90 Definition of the source category. -
98.91
§ 98.91 Reporting threshold. -
98.92
§ 98.92 GHGs to report. -
98.93
§ 98.93 Calculating GHG emissions. -
98.94
§ 98.94 Monitoring and QA/QC requirements. -
98.95
§ 98.95 Procedures for estimating missing data. -
98.96
§ 98.96 Data reporting requirements. -
98.97
§ 98.97 Records that must be retained. -
98.98
§ 98.98 Definitions. -
Appendix A to Subpart I of Part 98
Appendix A to Subpart I of Part 98—Alternative Procedures for Measuring Point-of-Use Abatement Device Destruction or Removal Efficiency -
Table I-1 to Subpart I of Part 98
Table I-1 to Subpart I of Part 98—Default Emission Factors for Manufacturing Capacity-Based Threshold Applicability Determination -
Table I-2 to Subpart I of Part 98
Table I-2 to Subpart I of Part 98—Default Emission Factors for Gas Consumption-Based Threshold Applicability Determination -
Table I-3 to Subpart I of Part 98
Table I-3 to Subpart I of Part 98—Default Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for Semiconductor Manufacturing for 150 <span class="standard">mm</span> and 200 <span class="standard">mm</span> Wafer Sizes -
Table I-4 to Subpart I of Part 98
Table I-4 to Subpart I of Part 98— Default Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for Semiconductor Manufacturing for 300 <span class="standard">mm</span> and 450 <span class="standard">mm</span> Wafer Size -
Table I-5 to Subpart I of Part 98
Table I-5 to Subpart I of Part 98—Default Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for MEMS Manufacturing -
Table I-6 to Subpart I of Part 98
Table I-6 to Subpart I of Part 98—Default Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for LCD Manufacturing -
Table I-7 to Subpart I of Part 98
Table I-7 To Subpart I of Part 98—Default Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for PV Manufacturing -
Table I-8 to Subpart I of Part 98
Table I-8 to Subpart I of Part 98—Default Emission Factors (1-UN<sub>2</sub>O<sub>,j</sub>) for N<sub>2</sub>O Utilization (UN<sub>2</sub>O<sub>,j</sub>) -
Table I-9 to Subpart I of Part 98
Table I-9 to Subpart I of Part 98—Methods and Procedures for Conducting Emissions Test for Stack Systems -
Table I-10 to Subpart I of Part 98
Table I-10 to Subpart I of Part 98—Maximum Field Detection Limits Applicable to Fluorinated GHG Concentration Measurements for Stack Systems -
Table I-11 to Subpart I of Part 98
Table I-11 to Subpart I of Part 98—Default Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for Semiconductor Manufacturing for Use With the Stack Test Method -
Table I-12 to Subpart I of Part 98
Table I-12 to Subpart I of Part 98—Default Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for Semiconductor Manufacturing for Use With the Stack Test Method -
Table I-13 to Subpart I of Part 98
Table I-13 to Subpart I of Part 98—Default Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for LCD Manufacturing for Use With the Stack Test Method -
Table I-14 to Subpart I of Part 98
Table I-14 to Subpart I of Part 98—Default Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for PV Manufacturing for Use With the Stack Test Method -
Table I-15 to Subpart I of Part 98
Table I-15 to Subpart I of Part 98—Default Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for MEMS Manufacturing for Use With the Stack Test Method -
Table I-16 to Subpart I of Part 98
Table I-16 to Subpart I of Part 98—Default Emission Destruction or Removal Efficiency (DRE) Factors for Electronics Manufacturing -
Table I-17 to Subpart I of Part 98
Table I-17 to Subpart I of Part 98—Expected and Possible By-Products for Electronics Manufacturing -
Table I-18 to Subpart I of Part 98
Table I-18 to Subpart I of Part 98—Default Factors for Gamma (<E T="8151">g</E><sub>i,p</sub> and <E T="8151">g</E><sub>k,i,p</sub>) for Semiconductor Manufacturing and for MEMS and PV Manufacturing Under Certain Conditions * for Use With the Stack Testing Method -
Table I-19 to Subpart I of Part 98
Table I-19 to Subpart I of Part 98—Reference Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes -
Table I-20 to Subpart I of Part 98
Table I-20 to Subpart I of Part 98—Reference Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for Semiconductor Manufacturing for 300 mm Wafer Sizes -
Table I-21 to Subpart I of Part 98
Table I-21 to Subpart I of Part 98—Examples of Fluorinated GHGs Used by the Electronics Industry