Table I-6 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for LCD Manufacturing
| Process type factors | Process gas i | ||||||||
|---|---|---|---|---|---|---|---|---|---|
| CF4 | C2 F6 | CHF3 | CH2 F2 | C3 F8 | c− C4 F8 | NF3 Remote | NF3 | SF6 | |
| Etch 1-Ui | 0.6 | NA | 0.2 | NA | NA | 0.1 | NA | NA | 0.3 |
| Etch BCF4 | NA | NA | 0.07 | NA | NA | 0.009 | NA | NA | NA |
| Etch BCHF3 | NA | NA | NA | NA | NA | 0.02 | NA | NA | NA |
| Etch BC2 F4 | NA | NA | 0.05 | NA | NA | NA | NA | NA | NA |
| CVD Chamber Cleaning 1-Ui | NA | NA | NA | NA | NA | NA | 0.03 | 0.3 | 0.9 |
| Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type. |
[75 FR 74818, Dec. 1, 2010, as amended at 78 FR 68225, Nov. 13, 2013]