- CFR
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- Title 40
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- Chapter I
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- Part 98
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- Subpart I
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- Appendix Table I-16 to Subpart I of Part 98
Table I-16 to Subpart I of Part 98—Default Emission Destruction or Removal Efficiency (DRE) Factors for Electronics Manufacturing
Table I-16 to Subpart I of Part 98—Default Emission Destruction or Removal Efficiency (DRE) Factors for Electronics Manufacturing
| Manufacturing type/process type/gas | Default DRE
(%) |
|---|
| MEMS, LCDs, and PV Manufacturing | 60 |
| Semiconductor Manufacturing: | |
| CF4 | 87 |
| CH3 F | 98 |
| CHF3 | 97 |
| CH2 F2 | 98 |
| C4 F8 | 93 |
| C4 F8 O | 93 |
| C5 F8 | 97 |
| C4 F6 | 95 |
| C3 F8 | 98 |
| C2 HF5 | 97 |
| C2 F6 | 98 |
| SF6 | 95 |
| NF3 | 96 |
| All other carbon-based fluorinated GHGs used in Semiconductor Manufacturing | 60 |
| N2 O Processes | |
| CVD and all other N2 O-using processes | 60 |
[89 FR 31922, Apr. 25, 2024]