Table I-5 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing
| Process type factors | Process gas i | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CF4 | C2 F6 | CHF3 | CH2 F2 | C3 F8 | c− C4 F8 | NF3 Remote | NF3 | SF6 | C4 F6a | C5 F8a | C4 F8 Oa | |
| Etch 1-Ui | 0.7 | 1 0.4 | 1 0.4 | 1 0.06 | NA | 1 0.2 | NA | 0.2 | 0.2 | 0.1 | 0.2 | NA |
| Etch BCF4 | NA | 1 0.4 | 1 0.07 | 1 0.08 | NA | 0.2 | NA | NA | NA | 1 0.3 | 0.2 | NA |
| Etch BC2 F6 | NA | NA | NA | NA | NA | 0.2 | NA | NA | NA | 1 0.2 | 0.2 | NA |
| CVD Chamber Cleaning 1-Ui | 0.9 | 0.6 | NA | NA | 0.4 | 0.1 | 0.02 | 0.2 | NA | NA | 0.1 | 0.1 |
| CVD Chamber Cleaning BCF4 | NA | 0.1 | NA | NA | 0.1 | 0.1 | 2 0.02 | 2 0.1 | NA | NA | 0.1 | 0.1 |
| CVD Chamber Cleaning BC3 F8 | NA | NA | NA | NA | NA | NA | NA | NA | NA | NA | NA | 0.4 |
| Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type. | ||||||||||||
| 1 Estimate includes multi-gas etch processes. | ||||||||||||
| 2 Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive. |
[75 FR 74818, Dec. 1, 2010, as amended at 78 FR 68225, Nov. 13, 2013]