eCFR.io
Daily eCFR

Table I-19 to Subpart I of Part 98—Reference Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Reference Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

CorpusDaily eCFR
Displayed edition2026-04-15
Last updated2026-04-15

Table I-19 to Subpart I of Part 98—Reference Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Table I-19 to Subpart I of Part 98—Reference Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Process type/sub-typeProcess gas i
CF4C2 F6CHF3CH2 F2C2 HF5CH3 FC3 F8C4 F8NF3SF6C4 F6C5 F8C4 F8 O
Etching/Wafer Cleaning
1-Ui0.730.460.310.370.0640.66NA0.210.200.550.0860.072NA
BCF4NA0.200.100.0310.077NANA0.170.00400.0230.0089NANA
BC2 F60.029NANANANANANA0.065NANA0.0450.014NA
BC4 F6NANANANANANANANANANANANANA
BC4 F8NANANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANANA
BC5 F8NANANANANANANA0.016NANANANANA
BCHF30.13NANANANANANANANANANA0.0039NA
Chamber Cleaning
In situ plasma cleaning
1-Ui0.920.55NANANANA0.400.100.18NANANA0.14
BCF4NA0.19NANANANA0.200.110.14NANANA0.13
BC2 F6NANANANANANANANANANANANA0.045
BC3 F8NANANANANANANANANANANANANA
Remote plasma cleaning
1-UiNANANANANANANANA0.028NANANANA
BCF4NANANANANANANANA0.015NANANANA
BC2 F6NANANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANANA
In situ thermal cleaning
1-UiNANANANANANANANANANANANANA
BCF4NANANANANANANANANANANANANA
BC2 F6NANANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANANA

[89 FR 31923, Apr. 25, 2024]