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Table I-3 to Subpart I of Part 98—Default Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for Semiconductor Manufacturing for 150 <span class="standard">mm</span> and 200 <span class="standard">mm</span> Wafer Sizes

Default Emission Factors (1-U<sub>ij</sub>) for Gas Utilization Rates (U<sub>ij</sub>) and By-Product Formation Rates (B<sub>ijk</sub>) for Semiconductor Manufacturing for 150 <span class="standard">mm</span> and 200 <span class="standard">mm</span> Wafer Sizes

CorpusDaily eCFR
Displayed edition2026-04-15
Last updated2026-04-15

Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Process type/sub-typeProcess gas i
CF4C2 F6CHF3CH2 F2C2 HF5CH3 FC3 F8C4 F8NF3SF6C4 F6C5 F8C4 F8 O
Etching/Wafer Cleaning
1-Ui0.730.720.510.130.0640.70NA0.140.190.550.0830.072NA
BCF4NA0.100.0850.0790.077NANA0.110.00400.130.095NANA
BC2 F60.041NA0.0350.0250.0240.0034NA0.0370.0250.110.0730.014NA
BC4 F8NANANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANANA
BCHF30.0910.047NA0.049NANANA0.040NA0.00120.0660.0039NA
Chamber Cleaning
In situ plasma cleaning
1-Ui0.920.55NANANANA0.400.100.18NANANA0.14
BCF4NA0.19NANANANA0.200.110.14NANANA0.13
BC2 F6NANANANANANANANANANANANA0.045
BC3 F8NANANANANANANANANANANANANA
Remote plasma cleaning
1-UiNANANANANANANANA0.028NANANANA
BCF4NANANANANANANANA0.015NANANANA
BC2 F6NANANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANANA
BF2NANANANANANANANA0.5NANANANA
In situ thermal cleaning
1-UiNANANANANANANANANANANANANA
BCF4NANANANANANANANANANANANANA
BC2 F6NANANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANANA
Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.

[89 FR 31920, Apr. 25, 2024]