PART 413—ELECTROPLATING POINT SOURCE CATEGORY
Contents
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A
Subpart A—Electroplating of Common Metals Subcategory Sections 413.10–413.14 -
B
Subpart B—Electroplating of Precious Metals Subcategory Sections 413.20–413.24 -
C
Subpart C—Electroplating of Speciality Metals Subcategory [Reserved] -
D
Subpart D—Anodizing Subcategory Sections 413.40–413.44 -
E
Subpart E—Coatings Subcategory Sections 413.50–413.54 -
F
Subpart F—Chemical Etching and Milling Subcategory Sections 413.60–413.64 -
G
Subpart G—Electroless Plating Subcategory Sections 413.70–413.74 -
General Provisions
General Provisions Sections 413.01–413.04 -
H
Subpart H—Printed Circuit Board Subcategory Sections 413.80–413.84